Omni-Path User Group
We have started an Omni-Path User Group (OPUG) to engage the community using the Intel® Omni-Path Architecture. The group will share experiences and insights using this technology.
To join OPUG, submit the OPUG Registration form.
BoF Session at SC17
The 2nd annual meeting of the Omni-Path User Group will be at a Birds-of-a-Feather (BoF) session at SC17. The BoF will be held on Tuesday, November 14, 2017, room location TBD. Please check the SC17 website for possible changes. Session leaders will be J Ray Scott, Senior Director of Facilities Technology at PSC and Philip Murphy, architect within the DCG Connectivity Group at Intel Corporation. The BoF will consist of an introduction, an OPA update from Philip Murphy, brief panel presentations from OPA site representatives, and a group discussion.
The following sites have confirmed that they will present on the panel:
- J Ray Scott, PSC: Bridges
- Dan Stanzione, TACC: Stampede 2
- Professor Satoshi Matsuoka, Tokyo Institute of Technology: TSUBAME3.0
Additional panelists will be announced here soon.
Intel® Omni-Path Architecture (Intel® OPA), an element of Intel® Scalable System Framework, delivers the performance for tomorrow’s high performance computing (HPC) workloads and the ability to scale to tens of thousands of nodes—and eventually more—at a price competitive with today’s fabrics. The Intel OPA 100 Series product line is an end-to-end solution of PCIe* adapters, silicon, switches, cables, and management software. As the successor to Intel® True Scale Fabric, this optimized HPC fabric is built upon a combination of enhanced IP and Intel® technology.